JPH01104739U - - Google Patents
Info
- Publication number
- JPH01104739U JPH01104739U JP40788U JP40788U JPH01104739U JP H01104739 U JPH01104739 U JP H01104739U JP 40788 U JP40788 U JP 40788U JP 40788 U JP40788 U JP 40788U JP H01104739 U JPH01104739 U JP H01104739U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- precious metal
- element mounting
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 5
- 239000010970 precious metal Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40788U JPH01104739U (en]) | 1988-01-05 | 1988-01-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40788U JPH01104739U (en]) | 1988-01-05 | 1988-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104739U true JPH01104739U (en]) | 1989-07-14 |
Family
ID=31199405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40788U Pending JPH01104739U (en]) | 1988-01-05 | 1988-01-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104739U (en]) |
-
1988
- 1988-01-05 JP JP40788U patent/JPH01104739U/ja active Pending